Blockchain and beyond
IEEE International Conference on
Decentralized Applications and Infrastructures
April 5 - 8, 2019
East Bay, San Francisco, California, USA
In conjunction with:
IEEE SOSE, IEEE Mobile Cloud, IEEE BigDataService, and IEEE AITest
Call for Papers

Call for papers


The objective of the 2019 IEEE International Conference on Decentralized Applications and Infrastructures (DAPPCON 2019) is to facilitate the exchange between researchers and practitioners in the area of Decentralized Applications based on Distributed Ledger Technologies, Blockchain and related technologies.

It can be already seen today that Blockchain is making a huge impact on the way digital payments are made. However, the potential implications of Blockchain technologies go far beyond their application as the technological backbone for cryptocurrencies. In recent years, Decentralized Applications (dApps) have emerged as a new model for building massively scalable services.

dApps allow for various novel application scenarios, which are build upon distributed consensus and thus are hard to block or censor. While Blockchains such as Bitcoin or Ethereum are based on compute-intense consensus mechanisms, more recent approaches focus on voting- or staking-based algorithms that support higher transactions per second and are also better-suited to reflect proportions of majority ownership, which are required in many enterprise application scenarios. Also, the integration of Smart Contracts into Blockchains, for example, based on Ethereum or Hyperledger, leads to a plethora of possible use cases for dApps.

DAPPCON 2019 will provide a high-quality forum for participants from research and industry. The conference will discuss key theories, algorithms, infrastructures, and significant applications for Decentralized Applications and Infrastructures, as well as emerging research topics.

Topics of interest include, but are not limited to:

  • Blockchain theory
  • Distributed Ledger Technologies (DLT)
  • Decentralized Applications / Smart Contracts
  • Consensus protocols for Decentralized Applications
  • Infrastructures for Decentralized Applications
  • Communication protocols and standards for Decentralized Applications
  • Identity Management for Decentralized Applications
  • Token economy
  • dApps/DLT/Blockchain analytics
  • dApps/DLT/Blockchain governance
  • dApps/DLT/Blockchain interoperability
  • dApps/DLT/Blockchain privacy
  • dApps/DLT/Blockchain security
  • dApps/DLT/Blockchain scalability and performance
  • dApps/DLT/Blockchain policy/law
  • dApps/DLT/Blockchain applications in areas such as Internet of Things, Logistics, or Health
  • dApps/DLT/Blockchain emerging research topics

Important Dates

  • Nov. 09, 2018: Paper abstract submission deadline
  • Nov. 16, 2018: Paper submission deadline
  • Dec. 17, 2018: Author notification
  • Jan. 31, 2019: Camera-ready submission and conference registration
  • Apr. 5 - 8, 2019: Conference

Paper submission

DAPPCON 2018 solicits research papers describing significant and innovative research contributions to the field of Decentralized Applications and Infrastructures.

Both full and short papers can be be submitted. All papers must be written in English. Manuscripts must include a title, an abstract with 200-250 words, and a list of 4-6 keywords. Each full paper is limited to 10 pages, including tables, figures and references. Each short paper is limited to 6 pages, including tables, figures and references.

All papers must be prepared in the IEEE double column proceedings format. Please see: http://www.ieee.org/conferences_events/conferences/publishing/templates.html

DAPPCON 2019 uses a double-blind review policy. Authors are required to remove their names, affiliation and other identifying information from the header of the manuscript. This also includes meta-data in the submitted document as well as acknowledgement sections. Papers that do not meet these anonymization requirements may be rejected without further review.

Authors are encouraged, but not required, to cite their previous work in a neutral manner, for example, avoid “in our previous work [3]” and instead use “as shown in [3]”.

The name(s) of the author(s) will not be visible to the reviewer of a paper. The name(s) of the author(s) will be visible in the submission system to the General Chairs and the Program Chairs. Authors are free to indicate any conflict of interest with the list of Technical Program Committee (TPC) members during submission of the manuscript, in which case the Program Chairs will exclude the corresponding TPC member(s) from reviewing the paper.

Each paper will be reviewed by at least three TPC members. Authors must submit their manuscripts using the EDAS conference system via the following link: http://edas.info/N25365 (paper submission opens on September 15th, 2018).

Paper publication

All accepted papers will be published by IEEE Computer Society Press (EI-Index) and included in the IEEE Digital Library. For publication, each accepted paper is required to be registered by one of its authors, and at least one author is required to attend and present the paper at the conference for the paper to be included in the final technical program and the IEEE Digital Library.


General Chairs

Axel Küpper, Technische Universität Berlin, Germany

Jie Xu, University of Leeds, United Kingdom

General Executive Chairs

Jerry Gao, San Jose State University, United States of America

Hong Zhu, Oxford Brookes University, United Kingdom

Program Committee Chairs

Peter Ruppel, Technische Universität Berlin, Germany

Stefan Schulte, Technische Universität Wien, Austria

Younghee Park, San Jose State University, United States of America

Local Organization

Jerry Gao, San Jose State University, United States of America

Registration Chair

Mahima Agumbe Suresh, San Jose State University, United States of America

Industry Chair

Divyesh Jadav, IBM Research, United States of America

Program Committee

Thomas Austin, San Jose State University, United States of America

Saswata Basu, 0CHAIN, United States of America

Paolo Bellavista, University of Bologna, Italy

John Calian, Deutsche Telekom, Germany

Sang-Yoon Chang, University of Colorado, United States of America

Chang-Wu Chen, AMIS, Taiwan

Noel Crespi, Institut Mines-Télécom, France

Avigdor Gal, Technion, Israel

Philipp Hoenisch, CoBloX, Australia

Hongxin Hu, Clemson University, United States of America

Richard Hull, Bell Labs Research, United States of America

Junbeom Hur, Korea University, Korea

Divyesh Jadav, IBM Research, United States of America

Ej Jung, University of San Francisco, United States of America

Dong Jin, Illinois Institute of Technology, United States of America

Hyoungshick Kim, Sungkyunkwan University, Korea

Younho Lee, SeoulTech, Korea

Alexander Norta, TalTech University, Estonia

Gokay Saldamli, San Jose State University, United States of America

Alessandra Scafuro, North Carolina State University, United States of America

Sandra Scott-Hayward, Queen's University Belfast, United Kingdom

Seungwon Shin, KAIST, Korea

Hyo Jung Song, San Francisco State University, United States of America

Athanasios V. Vasilakos, Luleå University of Technology, Sweden

Roman Vitenberg, University of Oslo, Norway

Ingo Weber, Data61/CSIRO, Australia

Edgar Weippl, SBA Research, FH St. Pölten, Austria

Simon Woo, Stony Brook University, United States of America

Xiwei Xu, Data61-CSIRO & UNSW, Australia

Attila Yavuz, University of South Florida, United States of America

Kaiwen Zhang, Université du Québec, Canada


DAPPCON 2019 will be hosted at:


Registration for DAPPCON 2019 will open in January 2019.